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R818

四核智能带屏语音芯片

产品

芯片框图

R818

基本规格

CPU

• Quad-core ARM Cortex™-A53 up to 1.6GHz
• 32KB L1 I-cache + 32KB L1 D-cache per core, 512KB L2 cache
• Low-power CoolFlex™ power management architecture

GPU

• GE8300 500MHz
• Supports OpenGLES1.1/2.0/3.2, Vulkan1.1, OpenCL1.2

Memory

• 32-bit DDR4/DDR3/DDR3L/LPDDR3/LPDDR4
• eMMC 5.0
• 8-bit TLC/MLC/SLC/EF NAND flash
• SPI Nand flash

Audio

• Supports two audio DAC and two audio ADC
• Supports two analog audio inputs and two analog audio outputs
• Stereo Speaker and capless stereo headphone driver
• Four I2S controllers for connecting Bluetooth and external audio codec
• Integrated digital microphone supports maximum 8 digital microphones

Process

• 28nm HPC+

Display

• Supports one channel MIPI DSI output, 4-lane, up to 1920×1200@60fps
• Supports LVDS output with dual link, up to 1920×1200@60fps
• Supports RGB interface with DE/SYNC mode, up to 1920×1200@60fps
• Supports size up to 2048x2048, with two video layer and two UI layer
• SmartColor2.0 post processing for an excellent display experience

Video

• Supports H.265 decoder 4k@30fps
• Supports H.264 decoder 1080p@30fps
• Supports VP8 decoder 1080p@60fps
• Supports H.264 HP encoder 1080P@60fps
• Supports MJPEG encoder 4k@15fps
• Supports JPEG encoder 13M

Camera

• Compliant with MIPI-CSI2 V1.00 and MIPI DPHY V1.00.00
• 2 MIPI CSI input, 4 data lane and 2 data lane, up to 1Gbps per Lane in HS
• Maximum to 8M@30fps or 13M@10fps, with 4 data lane
• Supports format: YUV422-8bit/10bit, YUV420-8bit/10bit, RAW-8, RAW-10, RAW-12, RGB888, RGB565

ISP

• Up to 8M@30fps or 13M@10fps, can be config as dual 1080p@60fps
• Adjustable 3A functions, including AE, AWB and AF
• Supports spatial(2D) de-noise filter
• Supports contrast enhance and sharping
• Supports chrominance noise reduction
• Supports defect pixel correction

Security

• Supports Symmetrical algorithm: AES, DES, 3DES, XTS, SM4
• Supports Hash algorithm: MD5, SHA, HMAC, SM3
• Supports Asymmetric algorithm: RSA, ECC, SM2
• Supports PRNG and TRNG
• Supports 2K-bit EFUSE for chip ID and security application

Connectivity

• USB 2.0 OTG and HOST, SDIO 3.0, GMAC
• SPI×3, TWI×5, 6xUART×6, PWM×5
• IR TX, IR RX, LEDC, GPADC, LRADC

PMIC

• AXP803 (w.charger)
• AXP806 (wo.charger)

Package

• LFBGA 346balls
• 12mm x 12mm size,0.5 ball pitch,0.3 ball size

OS

• Android 10

方案亮点

四核ARM Cortex™-A53架构
四核ARM Cortex™-A53架构
丽色系统:SmartColor™
丽色系统:SmartColor™
H265 4K@30fps 视频解码
H265 4K@30fps 视频解码
800万单摄像头,或500万+200万双摄像头
800万单摄像头,或500万+200万双摄像头
28nm工艺,BGA 12mm x 12mm封装
28nm工艺,BGA 12mm x 12mm封装
工规质量保障
工规质量保障

典型机型

R818

相关新闻

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